Electronic and optoelectronic component packaging technique

ABSTRACT

A package including a substrate, a plurality of components on the substrate, and a lid assembly including a plurality of integrated covers for at least select components on the substrate. A method of manufacturing such a lid assembly is also disclosed as is a packaging method.

RELATED APPLICATIONS

[0001] This application claims priority from provisional applicationserial No. 60/390,011 filed Jun. 19, 2002. This invention was made withU.S. Government support under Contract No. DAAH01-00-C-R070 awarded bythe U.S. Army. The Government may have certain rights in the subjectinvention.

FIELD OF THE INVENTION

[0002] This invention relates to an electronic and optoelectroniccomponent package, a unique lid assembly, and several useful packagesealing techniques.

BACKGROUND OF THE INVENTION

[0003] Semi-conductor packaging is an active field. U.S. Pat. No.5,827,999, incorporated herein by this reference, delineates thelimitations associated with numerous prior art packaging techniquesincluding encasement, the cavity package, and various thermoplastic chipcarrier packages. The basic purpose of any semi-conductor package isprotection of the component(s) (e.g., electronic chips, electroopticaldevices, and the like) housed by the package while at the same timeproviding electrical and/or optical interconnections from thecomponent(s) through the package. Manufacturability and protection arekey concerns. The applicant owns U.S. Pat. No. 6,320,257 disclosing asemiconductor packaging technique comprising an interconnect substrateincluding at least one layer of LCP material, at least one semiconductorcomponent bonded to the substrate, a lid, and a hermetic seal sealingthe lid to the substrate. This patent is hereby incorporated herein bythis reference. The '999 patent discloses the idea of molding a casingonto the circuit substrate around a chip. The casing can be made of,among other things, liquid crystal polymer material. As recognized bythe inventors hereof, LCP materials have a very low moisturepermeability and can provide a hermetic seal especially if the packagelid covering the chip and also the substrate which supports the chip areboth made of LCP or even if the lid assembly is composed of a metal,ceramic, or glass. Other relevant art includes U.S. Pat. Nos. 6,403,211;6,538,211; 6,057,597; 6,428,650; 6,136,128; 5,761,053; 6,501,654; and5,471,011; and patent Publication Nos. U.S. 2003/0,002,265; U.S.2002/0,187,570; U.S. 2001/0,019,475; U.S. 2003/0,026,556; U.S.2003/0,044,130; U.S. 2002/0,197,026; U.S. 2003/0,057,535; and U.S.2003/0,045,024.

[0004] This art, however, is not primarily concerned withmanufacturability. In most, if not all cases, a single component ismounted to a circuit substrate and then the lid or cover is secured overthe component to the substrate. Assembly of the components as singleentities consumes unnecessary time, effort, and cost in the componentassembly process. Also, the art listed above is not primarily concernedwith feasibility studies to ascertain the most economical methods ofsealing the cover over the component to the substrate.

BRIEF SUMMARY OF THE INVENTION

[0005] It is therefore an object of this invention to provide a highlyefficient package lid and substrate assembly process.

[0006] It is a further object of this invention to provide such aprocess which results in precision alignment of the package lids to theinterconnect substrate.

[0007] It is a further object of this invention to provide such aprocess which is versatile and can accommodate many different types ofcomponents, substrate designs, cover designs, and sealing processes.

[0008] It is a further object of this invention to provide a novelsemi-conductor package lid sub-assembly.

[0009] It is a further object of this invention to provide new ways ofefficiently and effectively sealing the cover over the component(s) tothe substrate.

[0010] This invention results from the realization that a highlyeffective package lid and assembly process is effected by injectionmolding a number of individual covers as an integrated lid sub-assembly,mating a populated interconnect substrate with the integrated lidsub-assembly, and then singulating the individual packages. Sealing theindividual covers over a component to the substrate can be accomplishedbefore singulation or even after singulation using a variety ofdifferent efficient methods.

[0011] This invention features a package comprising a substrate, aplurality of components on the substrate, and a lid assembly including aplurality of integrated covers for at least select components on thesubstrate.

[0012] In one example, the lid assembly includes a plurality of integralalignment pins and the substrate includes alignment holes which receivethe alignment pins to position the covers with respect to thecomponents. Typically, the pins are made of meltable material and thecovers are spaced from each other and the alignment pins are positionedin the spaces between the covers.

[0013] In one embodiment, the substrate is formed of at least one layerof a liquid crystal polymer material. The liquid crystal polymermaterial may be bi-axially oriented. In one example, the substrate is aprinted circuit board and there is a cover for each component on thesubstrate. Then, the covers are formed in an array and extend outwardfrom an interconnecting layer. Preferably, the lid assembly is formed ofa liquid crystal polymer material.

[0014] Also, there is a seal between each cover and the substrate suchas a laser welded seal, or an ultrasonically created seal. A susceptormaterial may be placed between the covers and the substrate to absorblaser energy when the covers are laser welded to the substrate. Thesubstrate may include pigmentation to absorb laser energy when thecovers are laser welded to the substrate or the covers may includepigmentation to absorb laser energy when the covers are laser welded tothe substrate. The covers may include energy directors for focusingultrasonic energy when the covers are ultrasonically welded to thesubstrate. In one example, the substrate includes cavities formedtherein which received the energy directors of the covers.

[0015] Typically, each cover includes sidewalls and a cap. There may befour sidewalls. Also, the lid assembly may further include a layerinterconnecting the caps of each cover which can be removed to singulatethe individual covers. In one embodiment, the cap includes an opticalwindow sealed to the cap by a laser. Preferably, the sidewalls include alower lip. And, in one example, each cover includes sidewalls eachterminating in a lip, the lips co-joined by an interconnecting layer.

[0016] This invention also features a packaging method comprisingassembling components on a substrate, manufacturing a lid assembly toinclude a plurality of integrated covers, and mating the lid assembly tothe substrate.

[0017] In one embodiment, the substrate includes alignment holes andmanufacturing includes forming alignment pins extending from the lidassembly which are received in the alignment holes of the substrate toposition the lid assembly covers with respect to the components. Furtherincluded may be the step of melting the pins to secure the lid assemblyto the substrate. Typically, the individual covers are singulated.Manufacturing may include forming a layer interconnecting the covers andsingulation includes removing the interconnecting layer. Or,manufacturing may include forming a layer interconnecting the covers andsingulation includes cutting through the interconnecting layer betweenthe individual covers. Cutting further may further include cutting thesubstrate between the individual covers.

[0018] In one example, manufacturing includes injection molding spacedcovers to each include sidewalls and a cap, the caps of all the coversinterconnected by an interconnecting layer. Mating may include adding abonding agent between the end of each cover sidewall and the substrate.Typically, the substrate is formed of at least one layer of a liquidcrystal polymer material. In one example, the liquid crystal polymermaterial is bi-axially oriented. In one embodiment, the substrate is aprinted circuit board and there is a cover for each component on thesubstrate. In one example, the covers are formed in an array and extendoutward from an interconnecting layer. Further included may be the stepof sealing each cover with respect to the substrate. Sealing includeslaser welding. A susceptor material may be disposed between the coversand the substrate to absorb laser energy when the covers are laserwelded to the substrate. Also, pigmentation can be added to thesubstrate to absorb laser energy. Or, pigmentation can be added to thecovers to absorb laser energy. In another example, sealing includesultrasonically welding each cover to the substrate. In this example,energy directors may be formed in the covers for focusing the ultrasonicenergy and cavities may be formed in the substrate to receive the energydirectors. Typically, a lower lip is formed for each cover. In oneembodiment, the lips of all covers are co-joined by an interconnectinglayer.

[0019] A lid assembly in accordance with this invention includes aplurality of covers each including sidewalls and a cap and aninterconnecting layer which integrates the covers for placement inunison over components on a substrate. Typically, the covers and theinterconnecting layer are formed of a liquid crystal polymer material byinjection molding. In one example, the interconnecting layer is acontinuous layer spanning the caps of all the covers. In anotherexample, the sidewalls include a lower lip portion and theinterconnecting layer co-joins the lower lip portions of the covers.

[0020] One package in accordance with this invention includes asubstrate made of LCP material, a plurality of components on thesubstrate, and a lid assembly including a plurality of integrated coversall made of LCP material and secured to the substrate, each coverdisposed over a component.

BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Other objects, features and advantages will occur to thoseskilled in the art from the following description of a preferredembodiment and the accompanying drawings, in which:

[0022] FIGS. 1A-1D are schematic three-dimensional views showing variousconventional package designs useful in connection with optoelectriccomponents;

[0023]FIG. 2 is a schematic three-dimensional bottom view showing, inone example, a lid sub-assembly in accordance with the subjectinvention;

[0024]FIG. 3 is a schematic three-dimensional view showing a printedcircuit board substrate before it is populated with components;

[0025]FIG. 4 is a schematic three-dimensional partial cross-sectionalview of the lid subassembly shown in FIG. 1;

[0026]FIG. 5 is a schematic three-dimensional view showing the printedcircuit board substrate of FIG. 2 now populated with components;

[0027]FIG. 6 is another schematic three-dimensional view showing oneexample of a lid sub-assembly in accordance with the subject invention;

[0028]FIG. 7 is a schematic three-dimensional view of the lidsub-assembly of FIG. 6 with a susceptor compound now in place on thebottoms of the individual covers;

[0029]FIG. 8 is a schematic three-dimensional view showing the lidsub-assembly of FIG. 7 being mated to the populated circuit boardsubstrate using the alignment pins of the subject invention;

[0030]FIG. 9 is a schematic three-dimensional view showing how, in oneembodiment, the alignment pins of the lid sub-assembly are melted to thesubstrate to secure the lid subassembly in place on the substrate;

[0031]FIG. 10 is a schematic three-dimensional view showing the lidsub-assembly now mated to the substrate in accordance with the subjectinvention just before singulation;

[0032]FIG. 11 is a schematic three-dimensional view showing theindividual covers after singulation in accordance with one embodiment ofthe subject invention;

[0033]FIG. 12 is a schematic three-dimensional view showing singulationof the covers and the substrate at the same time in accordance with theanother embodiment of the subject invention;

[0034]FIG. 13 is a schematic three-dimensional view showing another typeof lid sub-assembly interconnection layer in accordance with the subjectinvention;

[0035]FIG. 14 is a schematic three-dimensional view showing another typeof cover in accordance with the subject invention including an opticalwindow;

[0036]FIG. 15 is a schematic cross-sectional view of the optical windowtype cover of FIG. 14;

[0037]FIG. 16 is a schematic view showing an array of covers eachincluding a lower lip portion in accordance with the subject invention;

[0038]FIG. 17 is a schematic view showing a single cover of the array ofcovers shown in FIG. 16 just before it is sealed over a component andonto the substrate;

[0039]FIG. 18 is a schematic partial cross-sectional view showing howthe lower lip assembly of a single cover is sealed with respect to thesubstrate in accordance with one embodiment of the subject invention;

[0040]FIG. 19 is a schematic partial cross-sectional view showinganother method of sealing a cover to a substrate;

[0041]FIG. 20 is a schematic partial cross-sectional view showing stillanother method of sealing a cover to a substrate;

[0042]FIG. 21 is a schematic partial cross-sectional view showing stillanother method of sealing a cover to a substrate in accordance with thesubject invention;

[0043]FIG. 22 is a schematic view showing a frame-shaped ultrasonic hornuseful in connection with the subject invention for ultrasonicallysealing a cover to a substrate;

[0044]FIG. 23 is a bottom view of a single cover including ametallization layer in accordance with one embodiment of the subjectinvention;

[0045] FIGS. 24-29 are schematic views showing the steps involved inpackaging electronic components in accordance with this invention andalso showing another embodiment of the lid assembly in accordance withthis invention; and

[0046]FIG. 30 is a schematic view showing still another lid assemblyembodiment in accordance with the invention.

DISCLOSURE OF THE PREFERRED EMBODIMENT

[0047] Aside from the preferred embodiment or embodiments disclosedbelow, this invention is capable of other embodiments and of beingpracticed or being carried out in various ways. Thus, it is to beunderstood that the invention is not limited in its application to thedetails of construction and the arrangements of components set forth inthe following description or illustrated in the drawings.

[0048] FIGS. 1A-1D show typical packages 5A-5D for optoelectroniccomponents. One goal of the subject invention is to provide packages foroptoelectronic and other components which are more efficientlymanufactured and assembled thus reducing costs.

[0049]FIG. 2 shows, in one example of the subject invention, lidassembly 10 which includes an array of individual covers 12 each coverincluding, typically, four side walls 14 and a covering cap or top 15(see FIG. 4). Interconnecting layer 16, FIGS. 1 and 4, in thisembodiment, a continuous plate which integrates covers 12 for placementin unison over multiple components on a substrate. Lid assembly 10 istypically molded from filled LCP material (e.g., 30% glass filler) andmay even include multi-axially oriented material as discussed in theapplicant's U.S. Pat. No. 6,320,257 herein incorporated by thisreference. The use of LCP in place of other thermoplastic polymers ispreferred because LCP exhibits superior barrier properties, high usetemperature, and dimensional stability for precision molding tolerances.Other thermoplastics, other materials, and other forming processes,however, may also be used.

[0050] In one preferred embodiment, alignment pins 18, also made of LCPmaterial, extend outward from the molded interconnecting layer 16 in thespaces between the covers. Then, chip circuit board substrate 20, FIG. 3includes corresponding alignment holes 22. Substrate 20 typicallyincludes at least one layer, preferably the top layer, of multi-axiallyoriented LCP material as set forth in U. S. Pat. No. 6,320,257 (seeFIGS. 2b and 3 thereof). Thus, substrate 20, typically a printed circuitboard, can accommodate a wide variety of different types of components(chips, optical devices, MEMs devices, and the like) and alsoaccommodates a number of different chip mounting technologies (wirebonding, ball grid arrays, surface mount technology, and the like).Areas 24 on substrate 20 are dedicated to the components 26 as shown inFIG. 5.

[0051] In one example, a bonding agent; an adhesive, and/or a susceptor(e.g., Clearweld™) material 30, FIG. 2 may be dispensed (e.g., screened)onto the distal end of each sidewall, or onto the mating surface on thesubstrate, before lid assembly 10 is mated to the populated substrate20, FIG. 8 as the alignment pins 18 are received in the alignment holesas shown at 32. Next, ultrasonic horn 40, FIG. 9 can be used to melt thedistal ends of the alignment pins to secure lid assembly 10 to substrate20. Melting/welding of the alignment pins is not a necessary step as thesubsequent lid sealing process can form a sufficient mechanical bond ofthe lid to the substrate. Each cover may also be hermetically sealed tosubstrate 20 at this stage in the assembly process using one or more ofthe techniques discussed below. Each cover is typically associated withone component but a cover may also be disposed over multiple components.

[0052] Singulation can be carried out in a number of different ways. InFIG. 10, integration layer 16 is removed by back lapping, for example,to separate each cover 12, FIG. 11. Then, substrate 20 is singulated inone process step using conventional techniques. Or, in otherembodiments, substrate 20 may be left intact.

[0053] Alternatively, singulation of both the covers and substrate 20,FIG. 12 can be accomplished by cutting through both integration layer 16and substrate 20 as shown in FIG. 12 along lines 50 using (a routingtool, laser, water jet, or other cutting apparatus). If the lid assemblyand the substrate are manufactured in a certain way, the modules may besnapped apart rather than cut apart. For vibration or shock sensitivecomponents this may not be feasible, but in some cases asnap-singulation may be practical. The substrate would have to beembossed, etched, or scribed to snap along a line and the mating lidassemble would also have to include a snap line.

[0054]FIG. 13 shows a different kind of interconnecting layer 16 aspanning the tops 15 of each cover 12. The interconnection part of thelids depicted in FIG. 13 may be the runners used to injection mold thelid assembly. Again, this whole package lid sub-assembly can be moldedin the form shown in FIG. 13. Covers 12 are singulated by removing layer16 a and/or cutting through it in the areas between the individualcovers.

[0055] FIGS. 14-15 show a different type of cover 12a including opticalwindow 60 useful when the component housed in cover 12 a is an opticaldevice. Walls 14 a of cover 12 a include ledge 62 which supports opticalwindow 60. Window 60 may be laser welded in place on ledges 62. Theoptical window 60 may be made of a number of optical materials formedinto a number of shapes (e.g., flat optical window, collimating lens,micro-lens arrays, and the like).

[0056] FIGS. 16 shows alternative covers 12 b extending outward fromintegration layer 16 each including lower lip 70 useful, as describedbelow, for securing the covers to a substrate using a variety ofdifferent sealing processes in accordance with the subject invention andinterconnected by a bulk of injection molded material. This formation ofthe lid assembly can be locked in place or sealed and then backlapped tosingulate the lids.

[0057] The subject invention also includes a wide variety of methods forhermetically sealing lip 70, FIG. 17 of cover 12 over component 24 onsubstrate 20 either after cover 12 is singulated as shown in FIG. 17 oreven before cover 12 is singulated (i.e. when cover 12 is stillinterconnected to a number of similarly constructed covers). Typically,cover 12 is injection molded out of a filled LCP material and substrate20 is made of or includes bi-axially oriented LCP material.

[0058] LCP material is somewhat transparent to near-infrared radiation.Thus, in one example, susceptor material 100, FIG. 18 (e.g., Clearweld™,or an alternative IR absorbing material) is placed between lower lip 70of the cover and substrate 20 and infrared laser energy 102 is used toheat the interface between cover lip 70 and substrate 20 as the laserenergy is absorbed by susceptor material 100. The result is localizedheating which melts and seals the LCP material at the interface betweenlip 70 and substrate 20. The susceptor material may be printed, jetted,screened, or painted onto the lower lip of the cover and/or onto thesubstrate or even plated thereto. The thickness of lip 70 should be nogreater than 32 mils to achieve proper heating and a hermetic seal.

[0059] In another example, the LCP material of at least the top layer ofsubstrate 20′, FIG. 19 is pigmented with, for example, carbon resin 110prior to injection molding or extrusion of the material. When laserenergy 102 hits the pigmented substrate after passing through lip 70,heat is generated at the contact point between lip 70 and substrate 20′and a hermetic seal is created. The thickness, width, and geometry oflower lip 70 all play a part in the sealing effectiveness and can beoptimized for various different designs.

[0060] Another option is to pigment at least lip portion 70′, FIG. 20 ofthe cover and direct laser energy 102 to lip portion 70′ throughsubstrate 20. Now, the thickness of substrate 20 should be in the 2 to20 mil range. Pigmentation of the substrate (FIG. 19) or cover (FIG. 20)can be augmented with susceptor layer 100, FIG. 18. Standard diode laserwelding systems can be used as the source of laser energy.

[0061] In still another example, lower lip 70′, FIG. 21 of the coverincludes energy directing prongs 120 which are received in cavities 122formed in substrate 20′. An ultrasonic horn 140 is used to create heatat the interface between lower lip 70′ and substrate 20′. Energydirectors 120 are integrated into the lid design to focus the ultrasonicenergy in order to induce melting at the interface and provide ahermetic seal.

[0062] In FIG. 22 a plunge welding type ultrasonic welding system isused with frame shaped horn 142 which engages all four sides of lowerlip 70 of the cover simultaneously to hermetically seal cover 12 tosubstrate 20 in a single operation.

[0063] Finally, soldering as a sealing method can be used if LCP lip 70″or the entire cover, FIG. 23 is metallized on the bottom thereof atsealing interface 150 and if the substrate, not shown, also includesmetallization which mates with the lip of the cover.

[0064] The result is a hermetically sealed package and an efficient,scalable assembly process reducing time, effort, and cost. Depending onthe size of the component(s), panel level assembly as described hereincan increase the manufacturing efficiency by an estimated 50% or more.Typically, the package lid assembly is manufactured by injectionmolding. The printed circuit board may be manufactured with a footprintfor package sealing and precision alignment holes for aligned mating.The board is populated with the various components which may beelectrical, optoelectronic, and the like and then the panel of packagelids is mated with the component substrate. The panel lid assembly islocked to the substrate to maintain alignment and then each cover issealed before or after singulation of the packages. The alignment andlocking method described above is one of many possible mechanisms.Alternatives include, but are not limited to, alignment fiducials formedout of etched metal, screened on chemistries, drilled, and depositedmetal. These alignment fiducials will be located on both the substrateand the mating lid. As for the alignment pins, in addition to a straightpin that is ultrasonically melted to secure the assembly, a snap-fitalignment pin may also be implemented. The preferred substrate iscomposed of at least one layer of biaxially or multiaxially oriented LCPfilm and bond areas for silicon dice, integrated circuits, MEMs, MOEMs,or a variety of electronic or optoelectronic components that requirepackaging. One advantage of the subject invention is passive alignmentvia the alignment holes and the alignment pins. The dimensionalstability of the package lids and the dimensional stability the circuitboard are tight enough to eliminate the need for special alignmentmethods for panel level assembly. Passive alignment is especiallyimportant in the optoelectronic component arena, but may be useful formultimode applications where the tolerances are on the order of microns,rather than nanometers (singlemode fibers). When a component includes aglass window, a lens array, or other optical devices that requirealigned mating, passive alignment within a few microns is achieved andthe subject invention saves significant manufacturing time and money.

[0065] FIGS. 24-29 illustrate one possible packaging technique inaccordance with the subject invention. LCP substrate 200 FIG. 24 isbiaxial or multiaxial or includes layers of uniaxial LCP cross-plied.Alignment holes 202 are formed in at least the top layer of substrate200. Areas 204 receive the various components. Molded LCP assembly 208,FIG. 25 includes integrated covers 210 and alignment pins 212. Thisembodiment, each cover includes sidewalls 209 terminating in lip 213.The lips of all covers are co-joined by interconnecting layer 215. Aftersubstrate 200 is populated with components 211 as shown in FIG. 26, lidassembly 208, FIG. 27 is mated with substrate 200 as alignment pins 212are received in alignment holes 202. Laser 218, FIG. 28 is the used toseal all individual covers 210 to substrate 200. Singulate is theaccomplished as shown in FIG. 24 using router 220. The result isindividual packages as discussed above.

[0066]FIG. 30 shows another embodiment of an array of LCP covers 250interconnected by runners 252 which, during singulation, can be brokenor cut.

[0067] Although specific features of the invention are shown in somedrawings and not in others, this is for convenience only as each featuremay be combined with any or all of the other features in accordance withthe invention. The words “including”, “comprising”, “having”, and “with”as used herein are to be interpreted broadly and comprehensively and arenot limited to any physical interconnection. Moreover, any embodimentsdisclosed in the subject application are not to be taken as the onlypossible embodiments.

[0068] Other embodiments will occur to those skilled in the art and arewithin the following claims:

What is claimed is:
 1. A package comprising: a substrate; a plurality ofcomponents on the substrate; and a lid assembly including a plurality ofintegrated covers for at least select components on the substrate. 2.The package of claim 1 in which the lid assembly includes a plurality ofintegral alignment pins and the substrate includes alignment holes whichreceive the alignment pins to position the covers with respect to thecomponents.
 3. The package of claim 2 in which the pins are made ofmeltable material.
 4. The package of claim 2 in which the covers arespaced from each other and the alignment pins are positioned in thespaces between the covers.
 5. The package of claim 1 in which thesubstrate is formed of at least one layer of a liquid crystal polymermaterial.
 6. The package of claim 5 in which the liquid crystal polymermaterial is biaxially oriented.
 7. The package of claim 1 in which thesubstrate is a printed circuit board.
 8. The package of claim 1 in whichthere is a cover for each component on the substrate.
 9. The package ofclaim 1 in which the covers are formed in an array and extend outwardfrom an interconnecting layer.
 10. The package of claim 1 in which thelid assembly is formed of a liquid crystal polymer material.
 11. Thepackage of claim 1 further including a seal between each cover and thesubstrate.
 12. The package of claim 11 in which the seal is a laserwelded seal.
 13. The package of claim 11 in which the seal is anultrasonically created seal.
 14. The package of claim 1 furtherincluding a susceptor material between the covers and the substrate toabsorb laser energy when the covers are laser welded to the substrate.15. The package of claim 1 in which the substrate includes pigmentationto absorb laser energy when the covers are laser welded to thesubstrate.
 16. The package of claim 1 in which the covers includepigmentation to absorb laser energy when the covers are laser welded tothe substrate.
 17. The package of claim 1 in which the covers includeenergy directors for focusing ultrasonic energy when the covers areultrasonically welded to the substrate.
 18. The package of claim 17 inwhich the substrate includes cavities formed therein which received theenergy directors of the covers.
 19. The package of claim 1 in which eachcover includes sidewalls and a cap.
 20. The package of claim 19 in whichthere are four sidewalls.
 21. The package of claim 19 in which the lidassembly further includes a layer interconnecting the caps of each coverwhich can be removed to singulate the individual covers.
 22. The packageof claim 19 in which the cap includes an optical window
 23. The packageof claim 22 in which the optical window is laser sealed to the cap. 24.The package of claim 19 in which the sidewalls include a lower lip. 25.The package of claim 1 in which each cover includes sidewalls eachterminating in a lip, the lips co-joined by an interconnecting layer.26. A packaging method comprising: assembling components on a substrate;manufacturing a lid assembly to include a plurality of integratedcovers; and mating the lid assembly to the substrate.
 27. The method ofclaim 26 in which the substrate includes alignment holes andmanufacturing includes forming alignment pins extending from the lidassembly which are received in the alignment holes of the substrate toposition the lid assembly covers with respect to the components.
 28. Themethod of claim 26 further including the step of melting the pins tosecure the lid assembly to the substrate.
 29. The method of claim 26further including the step of singulating the individual covers.
 30. Themethod of claim 29 in which manufacturing includes forming a layerinterconnecting the covers and singulation includes removing theinterconnecting layer.
 31. The method of claim 29 in which manufacturingincludes forming a layer interconnecting the covers and singulationincludes cutting through the interconnecting layer between theindividual covers.
 32. The method of claim 31 wherein cutting furtherincluding cutting the substrate between the individual covers.
 33. Themethod of claim 26 in which manufacturing includes injection moldingspaced covers to each include sidewalls and a cap, the caps of all thecovers interconnected by an interconnecting layer.
 34. The method ofclaim 26 in which mating includes adding a bonding agent between the endof each cover sidewall and the substrate.
 35. The method of claim 26 inwhich the substrate is formed of at least one layer of a liquid crystalpolymer material.
 36. The method of claim 35 in which the liquid crystalpolymer material is biaxially oriented.
 37. The method of claim 26 inwhich the substrate is a printed circuit board.
 38. The method of claim26 in which there is a cover for each component on the substrate. 39.The method of claim 26 in which the covers are formed in an array andextend outward from an interconnecting layer.
 40. The method of claim 26further including the step of sealing each cover with respect to thesubstrate.
 41. The method of claim 40 in which sealing includes laserwelding.
 42. The method of claim 41 further including the step ofdisposing a susceptor material between the covers and the substrate toabsorb laser energy when the covers are laser welded to the substrate.43. The method of claim 41 further including adding pigmentation to thesubstrate to absorb laser energy.
 44. The method of claim 41 furtherincluding adding pigmentation to the covers to absorb laser energy. 45.The method of claim 40 in which sealing includes ultrasonically weldingeach cover to the substrate.
 46. The method of claim 45 in which energydirectors are formed in the covers for focusing the ultrasonic energy.47. The method of claim 46 in which cavities are formed in the substrateto receive the energy directors.
 48. The method of claim 26 furtherincluding forming a lower lip for each cover.
 49. The method of claim 26in the lips of all covers are co-joined by an interconnecting layer. 50.The method of claim 26 further including forming a window for eachcover.
 51. The method of claim 50 further including sealing the windowto the cover using a laser.
 52. A lid assembly comprising: a pluralityof covers each including sidewalls and a cap; and an interconnectinglayer which integrates the covers for placement in unison overcomponents on a substrate.
 53. The lid assembly of claim 50 in which thecovers and the interconnecting layer are formed of a liquid crystalpolymer material.
 54. The lid assembly of claim 53 in which the coversand the interconnecting layer are injection molded from a liquid crystalpolymer material.
 55. The lid assembly of claim 52 in which theinterconnecting layer is a continuous layer spanning the caps of all thecovers.
 56. The lid assembly of claim 52 further including a pluralityof alignment pins extending outward from the interconnecting layer foraligning the covers with respect to the components.
 57. The lid assemblyof claim 56 in which the pins are made of meltable material.
 58. The lidassembly of claim 56 in which the covers are spaced from each other andthe alignment pins are positioned in the spaced between the covers. 59.The lid assembly of claim 52 in which each cover includes four sidewallsextending from a cap.
 60. The lid assembly of claim 59 in which the capincludes an optical window.
 61. The lid assembly of claim 60 in whichthe optical window is sealed by a laser to the cap.
 62. The lid assemblyof claim 56 in which the sidewalls include a lower lip portion.
 63. Thelid assembly of claim 62 in which the sidewalls include a lower lipportion and the interconnecting layer co-joins the lower lip portions ofthe covers.
 64. A package comprising: a substrate made of LCP material;a plurality of components on the substrate; and a lid assembly includinga plurality of integrated covers all made of LCP material and secured tothe substrate, each cover disposed over a component.